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| Model Type |
 TE4302 1): TE4302RXPF 2): TE4302RDPF
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TE4301PF |

TE4300PF |
| SD Physical Layer Spec |
Ver.3.0 (UHS-Ⅰ) |
Ver.2.0 (High Speed) |
Ver.1.0 (Default Speed) |
| SD Clock |
Max.208MHz |
Max.50MHz |
Max.25MHz |
| SDIO Spec |
Ver.3.00 CPU I/F Mode Only 4bit synchronous interrupt and 8bit bus (eSDIO Only) are suppoted. |
Ver.2.00 |
Ver.1.00 |
eMMC Spec * Boot function is not Supported. |
Ver.4.4x |
Ver.4.3x |
Ver.3.xx |
| HOST I/F |
Selectable among PATA/CF/16bit/32bit bus |
16bit bus |
8bit/16bit bus |
| Operating Temperature Range |
1) -20 to +70 deg C or 2) -40 to +85 deg C |
-40 to +85 deg C |
0 to +70 deg C |
Package  |
12Pins BGA 1)0.5 mm ball pitch / 6 x 6mm / 1.2 mm high 2)0.8 mm ball pitch / 10 x 10mm / 1.4 mm high |
64Pins QFP 12 x 12mm |
48Pins QFP 9 x 9mm |
| Power source |
3.3V / 1.8V |
3.3V |
3.3V |
TD-BD-SDCMPTestC
SD Compliance Test System |
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This board is a SD memory card test tool for verifying compliancy to the SD compliance test spec, Part1_Test_Spec_for_Card_Version3.0 Test Group6 provided by SDA.
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Alphabet charactor represents following
notice.

| R = |
BGA package ( The product
number without "R" is provided by QFP package.) |
| PF= |
Pd Free products |
Note) The alphabet circled ( ) means package option product
is available to the customers.
ie. TExxxxPF(RPF) has tow package options (BGA and QFP) and
both are Pb Free. |
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